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DAC 2009 - Booth #722

Visit Apache at booth #722 and learn how to reduce cost and mitigate risk with the industry’s leading power and noise solutions for Chip-Package-System convergence. Attend presentations by leading semiconductor companies and learn about their methdology and experiences with Apache's tools. Sign-up for one of the product and technology roadmap presentations on RedHawk, Totem, Sentinel, and advanced technologies such as IO-SSO, ESD, and SiP/3DIC. Get a first hand experience in running RedHawk and Totem at hands-on-tutorial sessions.

DAC User Track presentations give uniqiue opportunity to discover how Apache's tools are being used by leading edge designs. Exhibitor Forum presentations provide technical overview of Apache's latest product offerings.

Apache At-A-Glance

Customer Presentations

• Broadcom: Prototyping to sign-off of 45nm Broadcom Mobility chip design
  Harpreet Anand, Principal Engineer
  Learn how Broadcom achieved early signoff of power/ground noise and reliability by prototyping and analyzing various low power design techniques and optimizing power gate / power pad placements and grid geometry ... (more)
• Rambus: High-speed I/O interface supply noise, and reliability analysis
  Dr. Ralf Schmitt, Senior Engineering Manager, Signal and Power Integrity
  Listen to Rambus’ power integrity analysis strategy and how it allowed them to accurately analyze the quality of power supply for large mixed-signal interface system operating at very high-speed I/O data rates ... (more)
• TSMC: SiP opportunities and design challenges
  Louis Liu, Deputy Director
  Listen to TSMC's strategy for addressing the challenges associated with SiP designs ... (more)

Seats are limited so register today! TO REGISTER

Product and Technology Roadmaps

• Apache Product Overview: From Prototyping to Sign-off
  Learn about Apache’s Chip-Package-System (CPS) convergence platforms including RedHawk - SoC dynamic power integrity, Totem - analog, mixed-signal, and memory power and noise analysis, and Sentinel - IC/Package co-design and SiP solution. TO REGISTER
• RedHawk-NX: Next Generation 45nm SoC Power Sign-off
  RedHawk-NX is Apache’s next generation full-chip power integrity solution with industry’s first Mesh Pattern Recognition (MPR) technology for handling ultra-large 45/32nm designs. This presentation will discuss the application of RedHawk-NX technology from early-stage prototyping to sign-off, as well as RedHawk Explorer for automatic design weakness and power noise root cause identification. In addition, this session will cover Apache’s advanced low power solution including MTCMOS ramp-up, shut-down, switch RAM, on-chip voltage regulators, and active back-biasing. TO REGISTER
• Totem: Analog / Mixed-signal Power and Substrate Noise Coupling
  Totem is Apache’s newest power, noise, and reliability solution for analog, mixed-signal, and memory designs. It is a layout-driven solution delivering 100M+ device capacity for concurrent simulation of power/ground, substrate, and package/PCB networks. This presentation will discuss the use of Totem for transistor-level dynamic power, substrate, and EM analysis, as well as its IP model generation capabilities for mixed transistor and cell-based design analysis. TO REGISTER
• Sentinel: Chip-Package-System Power, Signal, EMI, and Thermal Analysis
  Sentinel is Apache’s chip-package-system platform for power, signal, and thermal integrity, SSO analysis, and EMI validation. Sentinel platform includes PSI (power/signal integrity) for full package/board extraction and analysis with FFEM 3D full-wave technology; SSO for high capacity IO/DDR noise and timing analysis; TI (thermal integrity) for chip-package and SiP thermal co-analysis; and EMI for chip emission modeling and system EMI/EMC radiation analysis. This presentation will discuss unique technologies of Sentinel product line and how they provide a comprehensive solution for chip-package-system convergence. TO REGISTER
• Advanced Technologies: I/O-SSO, ESD, and SiP/3DIC
  These sessions will cover advanced topics such as noise analysis and its impact on high-speed IOs such as DDR3, clock, and package designs; analysis of electrostatic discharge behavior and the effectivenss of the circuit protection mechanisms; power and thermal challenges associated with SiP and 3DIC/TSV designs. Please contact Apache sales respresentive to reserve your seat.

Hands-On Tutorial

• Using RedHawk with Explorer to Prototype, Analyze, and Diagnose Root Cause of Advanced Low Power Designs
  In this tutorial, you will get a first-hand experience in running RedHawk with Explorer to analyze the power integrity of an advanced low power design, identify location of design weaknesses, and automatically trace back the root cause of the problem. TO REGISTER
• Using Totem for Layout-based Analysis of Power, Signal, and Substrate Noise of Analog, Mixed-signal, and Memory Designs
  In this tutorial, you’ll get hands-on experience in analyzing dynamic power, signal electro-migration, and substrate noise impact on a full-custom memory design. It will also cover debugging and diagnosing capabilities to help identify the cause of design issues. TO REGISTER

Apache at DAC 2009

To register for one or more sessions, please select REGISTER of one of the sessions you would like to attend and follow the instructions.

Seminar name:	Rambus
Summary:	High-speed I/O interface supply noise and reliability analysis
Location:	Booth #722
Date:	July 27, 2009 1pm-2pm
Seminar name:	TSMC
Summary:	SiP opportunties and design challenges
Location:	Booth #722
Date:	July 28, 2009 11am-12pm
Seminar name:	Broadcom
Summary:	Prototyping to sign-off of 45nm Broadcom Mobility chip design
Location:	Booth #722
Date:	July 28, 2009 1pm-2pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 27, 2009 10am-11am
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 27, 2009 11am-12pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 27, 2009 12pm-1pm
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 27, 2009 1pm-2pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 27, 2009 2pm-3pm
Seminar name:	Hands-On Tutorial: Totem
Summary:	Using Totem for Layout-based Analysis of Power, Signal, and Substrate Noise of Analog, Mixed-signal, and Memory Designs
Location:	Booth #722
Date:	July 27, 2009 3pm-5pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 27, 2009 3pm-4pm
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 27, 2009 4pm-5pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 27, 2009 5pm-6pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 28, 2009 10am-11am
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 28, 2009 11am-12pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 28, 2009 12pm-1pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 28, 2009 1pm-2pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 28, 2009 2pm-3pm
Seminar name:	Hands-On Tutorial: RedHawk with Explorer
Summary:	Using RedHawk with Explorer to Prototype, Analyze, and Diagnose Root Cause of Advanced Low Power Designs
Location:	Booth #722
Date:	July 28, 2009 3pm-5pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 28, 2009 3pm-4pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 28, 2009 4pm-5pm
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 28, 2009 5pm-6pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 29, 2009 10am-11am
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 29, 2009 11am-12pm
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 29, 2009 12pm-1pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 29, 2009 1pm-2pm
Seminar name:	Apache Product Overview
Summary:
Location:	Booth #722
Date:	July 29, 2009 2pm-3pm
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 29, 2009 3pm-4pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 29, 2009 4pm-5pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 29, 2009 5pm-6pm
Seminar name:	Totem
Summary:	Analog / Mixed-signal Power and Substrate Noise Coupling
Location:	Booth #722
Date:	July 30, 2009 10am-11am
Seminar name:	RedHawk-NX
Summary:	Next Generation 45nm SoC Power Sign-off
Location:	Booth #722
Date:	July 30, 2009 11am-12pm
Seminar name:	Sentinel
Summary:	Chip-Package-System Power, Signal, EMI, and Thermal Analyses
Location:	Booth #722
Date:	July 30, 2009 12pm-1pm